High-performance bisphenol-F-based epoxy resin offering excellent chemical resistance and thermal stability.
Low viscosity formulation enables easy processing, impregnation, and compatibility with fiber reinforcements.
Optimized for room-temperature or elevated-temperature curing with standard amine hardeners.
Superior adhesion to metals, composites, and cured thermosets—ideal for structural bonding and repair.
Low volatile organic compound (VOC) content, supporting compliance with industrial environmental and safety standards.
Aerospace composite tooling and mandrel systems requiring dimensional stability and release performance.
Wind turbine blade root joints and spar cap bonding in high-load structural assemblies.
Repair and refurbishment of marine and offshore composite structures exposed to harsh environments.
Electrical insulation systems in high-voltage transformers and bushings.
Advanced pultrusion and filament winding matrices for corrosion-resistant profiles and rods.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, low-viscosity liquid |
| Epoxide Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 800–1,200 mPa·s |
| Color (Gardner) | ≤3 |
| Density at 25°C | 1.16–1.18 g/cm³ |
| Primary Applications | Structural composites, bonding, tooling, electrical insulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China