High-purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.
Low viscosity (< 12,000 cP at 25°C) enabling excellent flow, wetting, and processability in casting, impregnation, and coating applications.
Excellent thermal stability and hydrolytic resistance, supporting long pot life and stable performance under humid processing conditions.
Low chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation and metal-coated systems.
Optimized for compatibility with standard amine and anhydride curing agents, facilitating flexible formulation design.
Electrical insulation and encapsulation of transformers, reactors, and high-voltage components.
Potting and casting of power electronics, including IGBT modules and EV battery management systems.
Structural adhesives for aerospace composite bonding and automotive lightweight assemblies.
High-performance protective coatings for offshore platforms, chemical storage tanks, and industrial flooring.
Wind turbine blade bonding and rotor hub encapsulation requiring fatigue-resistant thermoset matrices.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxide Equivalent Weight (EEW) | 183–192 g/eq |
| Viscosity (25°C) | 9,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–18°C |
| Primary Applications | Encapsulation, potting, structural adhesives, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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