Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Hexion EPIKOTE 827 Epoxy Resin

Hexion EPIKOTE 827 is a low-viscosity, bisphenol-A-based liquid epoxy resin widely used in composites, coatings, and adhesives. It offers excellent mechanical strength, chemical resistance, and reliable curing with amines or anhydrides. Ideal for aerospace, automotive, and industrial applications requiring high performance and processability.
  • hexion epikote 827 epoxy resin_22f32ef2
  • hexion epikote 827 epoxy resin_22f32ef2

Features Of Hexion EPIKOTE 827 Epoxy Resin

  1. Standard liquid bisphenol-A epoxy resin with consistent molecular weight distribution for reliable reactivity and processing.

  2. Excellent adhesion to metals, composites, and cured polymer substrates across diverse environmental conditions.

  3. High purity and low chloride content, supporting superior electrical insulation properties and reduced corrosion risk.

  4. Proven compatibility with a broad range of amine, anhydride, and phenolic curing agents for formulation flexibility.

  5. Good thermal stability and mechanical performance in cured systems, enabling durable structural and protective coatings.

Typical Applications Of Hexion EPIKOTE 827 Epoxy Resin

  1. Aerospace composite matrices for primary and secondary structural components.

  2. Electrical encapsulation and potting compounds for high-voltage insulators and power electronics.

  3. High-performance industrial maintenance and marine coatings requiring chemical resistance and long-term durability.

  4. Adhesives for metal-to-metal and metal-to-composite bonding in transportation and wind energy sectors.

  5. Tooling resins for molds used in carbon fiber layup and RTM processes.

Specifications Of Hexion EPIKOTE 827 Epoxy Resin

Chemical TypeLiquid bisphenol-A diglycidyl ether epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceClear, slightly viscous liquid at 25°C
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity at 25°C12,000–14,000 cP
Chloride Content≤ 500 ppm
Softening Point12–18°C
Primary ApplicationsStructural composites, electrical encapsulation, high-performance coatings, adhesives


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