Standard liquid bisphenol-A epoxy resin with consistent molecular weight distribution for reliable reactivity and processing.
Excellent adhesion to metals, composites, and cured polymer substrates across diverse environmental conditions.
High purity and low chloride content, supporting superior electrical insulation properties and reduced corrosion risk.
Proven compatibility with a broad range of amine, anhydride, and phenolic curing agents for formulation flexibility.
Good thermal stability and mechanical performance in cured systems, enabling durable structural and protective coatings.
Aerospace composite matrices for primary and secondary structural components.
Electrical encapsulation and potting compounds for high-voltage insulators and power electronics.
High-performance industrial maintenance and marine coatings requiring chemical resistance and long-term durability.
Adhesives for metal-to-metal and metal-to-composite bonding in transportation and wind energy sectors.
Tooling resins for molds used in carbon fiber layup and RTM processes.
| Chemical Type | Liquid bisphenol-A diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Clear, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–18°C |
| Primary Applications | Structural composites, electrical encapsulation, high-performance coatings, adhesives |
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E-mail: wangxingqiang@ericwchem.com
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