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High-purity bisphenol-A based liquid epoxy resin with low ionic impurity content.
Excellent thermal stability and consistent reactivity with standard amine and anhydride hardeners.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing and superior wetting of reinforcements.
Outstanding electrical insulation properties and low dielectric loss at elevated frequencies.
Compliant with RoHS and REACH regulations for restricted substances.
Electrical encapsulation and potting compounds for transformers, reactors, and high-voltage insulators.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
Structural adhesives for aerospace composite bonding and automotive lightweight assemblies.
Wind turbine blade matrix resins requiring long gel time and controlled exotherm.
High-performance coatings for corrosion-resistant industrial tank linings and marine infrastructure.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel or sediment |
| Epoxy Equivalent Weight (EEW) | 545–565 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Chloride Content | ≤ 750 ppm |
| Volatiles Content | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
