High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface pretreatment.
Low viscosity (1200–1800 mPa·s at 25°C) enabling easy handling, degassing, and impregnation of fiber reinforcements.
Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure with dicyandiamide.
Low chloride content (<300 ppm), ensuring high electrical insulation performance and corrosion resistance in electronic encapsulation.
Aerospace composite matrices for structural laminates and honeycomb core bonding.
Electrical insulation systems for high-voltage transformers and bushings.
Encapsulation and potting of power electronics, including IGBT modules and EV battery management components.
Prepreg and filament winding resins for pressure vessels and industrial piping.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid resin |
| Appearance | Clear, pale yellow liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 1200–1800 mPa·s |
| Chloride Content | <300 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at <25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China