Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Shikoku 2PZ-OK Epoxy Resin

Shikoku 2PZ-OK Epoxy Resin is a high-purity, low-viscosity liquid epoxy resin from Shikoku Chemicals’ 2PZ series, engineered for advanced composites and electronic encapsulation. It offers excellent thermal stability, low ionic impurities, and superior adhesion to fillers—ideal for high-reliability LED packaging and aerospace applications.
  • shikoku 2pz ok epoxy resin_5113b420
  • shikoku 2pz ok epoxy resin_5113b420

Features Of Shikoku 2PZ-OK Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and cured epoxy substrates without surface pretreatment.

  3. Low viscosity (1200–1800 mPa·s at 25°C) enabling easy handling, degassing, and impregnation of fiber reinforcements.

  4. Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure with dicyandiamide.

  5. Low chloride content (<300 ppm), ensuring high electrical insulation performance and corrosion resistance in electronic encapsulation.

Typical Applications Of Shikoku 2PZ-OK Epoxy Resin

  1. Aerospace composite matrices for structural laminates and honeycomb core bonding.

  2. Electrical insulation systems for high-voltage transformers and bushings.

  3. Encapsulation and potting of power electronics, including IGBT modules and EV battery management components.

  4. Prepreg and filament winding resins for pressure vessels and industrial piping.

Specifications Of Shikoku 2PZ-OK Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F (DGEBF)
Product FormLiquid resin
AppearanceClear, pale yellow liquid
Epoxy Equivalent Weight (EEW)165–175 g/eq
Viscosity (25°C)1200–1800 mPa·s
Chloride Content<300 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at <25°C in sealed containers


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