High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Low viscosity for easy processing, mixing, and impregnation of fibers or fillers.
Good thermal stability and mechanical strength after full cure.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
Electrical encapsulation and potting compounds for transformers and sensors.
Fiber-reinforced composites in wind turbine blades and automotive structural parts.
High-performance adhesives for aerospace and electronics assembly.
Coating systems for corrosion-resistant industrial linings and tank interiors.
Printed circuit board (PCB) laminates and prepreg formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China