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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for enhanced electrical insulation performance.
Optimized viscosity for improved processability in casting, laminating, and adhesive formulations.
Superior adhesion to metals, glass fibers, and composite substrates.
Compatible with standard amine, anhydride, and phenolic curing agents.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance prepregs and laminates in printed circuit board (PCB) manufacturing.
Structural adhesives for aerospace and automotive composite bonding.
Wind turbine blade matrix resins requiring dimensional stability and fatigue resistance.
Protective coatings for corrosion-resistant industrial linings and tank interiors.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Softening Point | 12–15°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
