High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss for electronic encapsulation applications.
Good hydrolytic stability and resistance to yellowing under UV exposure in cured state.
Electrical & electronic encapsulants for LEDs, sensors, and power modules.
Potting compounds for automotive control units and onboard charging systems.
High-performance laminating resins for printed circuit board (PCB) prepregs.
Structural adhesives requiring thermal stability and chemical resistance.
Coating formulations for corrosion protection of metal substrates in industrial environments.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, potting, laminating, adhesive bonding |
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E-mail: wangxingqiang@ericwchem.com
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