Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Mitsui Epokey859FX Modified Epoxy Resin

Mitsui Epokey859FX is a modified epoxy resin from Mitsui Chemicals’ Epokey® series, engineered for enhanced flexibility, adhesion, and thermal stability. It features low viscosity, excellent compatibility with tougheners, and superior electrical insulation—ideal for advanced composites, encapsulants, and high-reliability electronic packaging applications.
  • mitsui epokey859fx modified epoxy resin_4bad0ed5
  • mitsui epokey859fx modified epoxy resin_4bad0ed5

Features Of Mitsui Epokey859FX Modified Epoxy Resin

  1. Enhanced flexibility and impact resistance compared to standard bisphenol-A epoxy resins.

  2. Improved adhesion to challenging substrates including aluminum, stainless steel, and composite laminates.

  3. Low viscosity at room temperature, enabling easy processing via casting, impregnation, or filament winding.

  4. Excellent thermal stability with glass transition temperature (Tg) exceeding 120 °C after full cure.

  5. Reduced shrinkage during curing, minimizing internal stress and improving dimensional accuracy in precision parts.

Typical Applications Of Mitsui Epokey859FX Modified Epoxy Resin

  1. Aerospace structural adhesives and composite matrix resins for secondary bonding and interior components.

  2. High-performance electrical encapsulants and potting compounds for power electronics and EV battery modules.

  3. Wind turbine blade bonding and repair systems requiring fatigue-resistant, low-creep performance.

  4. Automotive under-hood composites and lightweight structural assemblies exposed to thermal cycling.

  5. Industrial tooling and mold-making where dimensional stability and surface replication fidelity are critical.

Specifications Of Mitsui Epokey859FX Modified Epoxy Resin

Chemical TypeModified Bisphenol-F / Novolac Epoxy Blend
Product FormLiquid, Low-VOC, Solvent-Free
AppearanceAmber-Transparent, Slight Viscosity
Viscosity (25 °C)8,000–12,000 mPa·s
Epoxy Equivalent Weight (EEW)185–195 g/eq
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsStructural Adhesives, Composite Matrices, Encapsulants
Key FeaturesFlexibility, Thermal Stability, Substrate Adhesion, Low Shrinkage


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