Enhanced flexibility and impact resistance compared to standard bisphenol-A epoxy resins.
Improved adhesion to challenging substrates including aluminum, stainless steel, and composite laminates.
Low viscosity at room temperature, enabling easy processing via casting, impregnation, or filament winding.
Excellent thermal stability with glass transition temperature (Tg) exceeding 120 °C after full cure.
Reduced shrinkage during curing, minimizing internal stress and improving dimensional accuracy in precision parts.
Aerospace structural adhesives and composite matrix resins for secondary bonding and interior components.
High-performance electrical encapsulants and potting compounds for power electronics and EV battery modules.
Wind turbine blade bonding and repair systems requiring fatigue-resistant, low-creep performance.
Automotive under-hood composites and lightweight structural assemblies exposed to thermal cycling.
Industrial tooling and mold-making where dimensional stability and surface replication fidelity are critical.
| Chemical Type | Modified Bisphenol-F / Novolac Epoxy Blend |
| Product Form | Liquid, Low-VOC, Solvent-Free |
| Appearance | Amber-Transparent, Slight Viscosity |
| Viscosity (25 °C) | 8,000–12,000 mPa·s |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Structural Adhesives, Composite Matrices, Encapsulants |
| Key Features | Flexibility, Thermal Stability, Substrate Adhesion, Low Shrinkage |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China