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High reactivity with amine and anhydride curing agents, enabling rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (8,000–12,000 cP at 25°C) for easy processing, impregnation, and void-free casting.
Superior thermal stability with glass transition temperature (Tg) exceeding 130°C after full cure.
Low chloride content (< 500 ppm), ensuring compatibility with sensitive electronic encapsulation applications.
Electrical insulation systems for medium- and high-voltage transformers and reactors.
Structural adhesive formulations for aerospace composite bonding and repair.
Encapsulation and potting of power electronics, including IGBT modules and EV battery control units.
Prepreg matrix resin for carbon fiber reinforced laminates used in wind turbine blades and automotive components.
High-performance flooring and industrial coating systems requiring chemical resistance and abrasion durability.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 9,500–11,500 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Room temperature (liquid) |
| Storage Stability | 12 months at < 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
