High purity solid bisphenol-A based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content for safer processing.
Superior adhesion to metals, composites, and cured polymer substrates.
Optimized melt viscosity for efficient solvent-free coating, casting, and adhesive formulation.
Compatible with standard amine, anhydride, and phenolic curing agents across industrial systems.
High-performance powder coatings for automotive and appliance components.
Structural adhesives in aerospace and wind turbine blade assembly.
Electrical encapsulation and insulating potting compounds for power electronics.
Prepreg matrix resins for carbon fiber and glass fiber reinforced laminates.
High-gloss decorative flooring and industrial terrazzo systems.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Pale yellow to off-white solid flakes or pellets |
| Appearance | Homogeneous solid, free from visible impurities |
| Epoxy Equivalent Weight (EEW) | 460–510 g/eq (varies by grade: 907, 907L, 909, 909H) |
| Melt Viscosity (150°C) | 8,000–15,000 cP (grade-dependent) |
| Softening Point | 75–95°C (determined per ASTM E28) |
| Chlorine Content | ≤ 1,200 ppm (total chlorine) |
| Key Features | Low color, high reactivity, batch-to-batch consistency |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China