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High purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW).
Excellent adhesion to metals, composites, and cured thermoset substrates.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and impregnation.
Good thermal stability and hydrolytic resistance for demanding service environments.
Compatible with standard amine, anhydride, and phenolic hardeners for versatile curing profiles.
Structural adhesives for aerospace and automotive bonding.
Matrix resin in fiber-reinforced composites (e.g., carbon/glass fiber laminates).
Electrical encapsulation and potting compounds for high-voltage components.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
High-performance flooring and grouting formulations in industrial facilities.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Composite matrices, structural adhesives, electrical encapsulants, protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
