High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without primer.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Good chemical resistance to alkalis, solvents, and moderate acids after full cure.
Low volatile organic compound (VOC) content, compliant with industrial environmental safety standards.
Structural adhesive formulations for aerospace composite bonding and metal-to-composite joints.
Matrix resin in filament-wound pressure vessels and high-pressure composite tanks.
Encapsulation and potting of high-voltage electrical components and power electronics.
Prepreg systems requiring low-temperature cure capability and high Tg retention.
Repair and refurbishment resins for wind turbine blade leading-edge protection.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 180–190 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at 20–25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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