High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility for safe handling and processing.
Superior adhesion to metals, glass, and composite substrates.
Low viscosity at elevated temperatures, enabling easy impregnation and coating application.
Compatible with standard amine and anhydride curing agents for versatile formulation design.
Electrical insulation systems for dry-type transformers and reactors.
Structural adhesives in aerospace and automotive composite bonding.
Prepregs and laminates for high-performance printed circuit boards (PCBs).
Encapsulation and potting compounds for power electronics and LED modules.
Wind turbine blade matrix resins requiring enhanced mechanical integrity and fatigue resistance.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Amber to light yellow viscous liquid |
| Appearance | Clear, homogeneous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 12–16°C |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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