High purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Good thermal stability and low viscosity for easy processing and impregnation.
Superior electrical insulation properties suitable for electronic encapsulation.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
Electrical insulation coatings for transformers and busbars.
Encapsulation compounds for power modules and LED drivers.
Structural adhesives in automotive and aerospace composite assemblies.
Matrix resin for filament-wound pipes and pressure vessels.
Base resin for high-performance casting and potting formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–14,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | 12–16°C |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China