High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss at elevated frequencies.
Good thermal stability with glass transition temperature (Tg) of cured system up to 125°C.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
High-voltage insulating varnishes and coil impregnation resins in motor and generator manufacturing.
Structural adhesives requiring thermal resistance and dimensional stability under cyclic loading.
Composite matrix resin for glass fiber-reinforced laminates in aerospace and industrial tooling.
UV-curable hybrid formulations when combined with acrylate co-monomers and photoinitiators.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Epoxide Content | 17.5–18.2 wt% |
| Volatile Matter (max) | 0.3 wt% |
| Chloride Content (max) | 800 ppm |
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E-mail: wangxingqiang@ericwchem.com
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