High reactivity with standard amine and anhydride hardeners for rapid cure development.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and good wetting in composite impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of approx. 125–135°C after full cure.
Electrical encapsulation and potting compounds for power electronics and transformers.
Structural adhesives in automotive and aerospace assembly.
Matrix resin for fiber-reinforced composites in wind turbine blades and industrial tooling.
Coating formulations for corrosion-resistant protective linings in chemical equipment.
High-performance casting resins for precision industrial components and insulators.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity (25°C) | 12,000–14,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China