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Highly latent at room temperature—enables extended pot life and excellent storage stability.
Activates rapidly upon thermal triggering (typically >100 °C), ensuring efficient epoxy resin curing.
Halogen-free formulation, supporting environmental compliance and RoHS/REACH requirements.
Delivers high glass transition temperature (Tg) and excellent mechanical properties in cured networks.
Low volatility and minimal odor—improves workplace safety and processing comfort.
Prepregs for aerospace and high-performance composites.
Encapsulants and molding compounds in power electronics and EV battery modules.
Structural adhesives requiring long shelf life and precise thermal activation.
Coatings for metal substrates demanding high crosslink density and chemical resistance.
3D printing resins (SLA/DLP) where controlled reactivity and low dark-cure are critical.
| Chemical Type | Latent imidazole derivative |
| Product Form | Powder |
| Appearance | White to off-white free-flowing powder |
| Primary Applications | Epoxy resin systems for composites, encapsulation, and adhesives |
| Key Features | Thermally activated, halogen-free, low volatility |
| Onset Activation Temperature | Approx. 105 °C (by DSC) |
| Storage Stability | ≥12 months at 25 °C in sealed container |
| Recommended Loading Range | 3–8 phr (parts per hundred resin) |
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