English
Español
tiếng việt
русский
Highly latent at room temperature—enables extended pot life and excellent storage stability.
Activates rapidly upon thermal triggering (typically >120 °C), ensuring efficient epoxy curing without premature reaction.
Halogen-free formulation, supporting environmentally conscious manufacturing and regulatory compliance (e.g., RoHS, REACH).
Delivers superior thermal and mechanical performance in cured epoxy systems, including high glass transition temperature (Tg) and dimensional stability.
Compatible with standard diglycidyl ether of bisphenol-A (DGEBA) and multifunctional epoxy resins.
Prepregs for aerospace and high-performance composites.
Encapsulants and underfills for semiconductor packaging.
Structural adhesives requiring long working time and fast heat-cure cycles.
Electrically insulating coatings and laminating resins for printed circuit boards (PCBs).
3D printing resins with controlled reactivity and post-cure efficiency.
| Chemical Type | Dicyandiamide (DICY)-based latent accelerator system |
| Product Form | White to off-white free-flowing powder |
| Appearance | Free-flowing crystalline powder |
| Primary Applications | Epoxy resin systems requiring delayed cure onset and thermal activation |
| Key Features | Latency, halogen-free, high Tg promotion, low volatility |
| Recommended Storage | Below 25 °C, dry and sealed conditions |
| Onset Activation Temperature | Approx. 120–125 °C (by DSC) |
| Shelf Life (unopened) | 12 months from date of manufacture under recommended storage |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
