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Highly latent at room temperature, enabling extended pot life and improved handling safety.
Activates rapidly upon heating (typically >120 °C), ensuring efficient epoxy resin curing without premature reaction.
Halogen-free formulation, supporting compliance with RoHS and other environmental regulations.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Delivers high glass transition temperature (Tg) and mechanical strength in cured thermosets.
Prepregs for aerospace and high-performance composites.
Electrically insulating encapsulants and potting compounds for power electronics.
Structural adhesives requiring precise thermal activation control.
Coatings and laminates demanding low volatility and minimal outgassing.
3D printing resins where shelf-stable, heat-triggered crosslinking is required.
| Chemical Type | Latent imidazole derivative |
| Product Form | Powder |
| Appearance | White to off-white free-flowing powder |
| Primary Applications | Epoxy resin curing agent for high-performance thermosets |
| Key Features | Thermally activated, halogen-free, low dust generation |
| Storage Conditions | Store under dry conditions at 5–30 °C; protect from moisture |
| Onset Activation Temperature | ≈120 °C (by DSC) |
| Shelf Life | ≥12 months under recommended storage conditions |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
