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Highly latent at room temperature, enabling extended pot life and excellent storage stability.
Activates rapidly upon heating, delivering efficient epoxy resin curing above 120 °C.
Halogen-free formulation, supporting environmental compliance and low-halogen electronics requirements.
Low volatility and minimal odor, enhancing workplace safety and handling convenience.
Excellent compatibility with standard bisphenol-A and novolac epoxy resins.
Encapsulants and molding compounds for semiconductor packaging.
Powder coatings requiring high flow, smooth finish, and controlled cure onset.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
Adhesives for electronic assembly where shelf-life and thermal-triggered bonding are critical.
Structural composites requiring precise processing windows and low-migration additives.
| Chemical Type | Latent imidazole derivative |
| Product Form | Free-flowing white powder |
| Appearance | White to off-white crystalline powder |
| Primary Applications | Epoxy-based encapsulants, powder coatings, PCB laminates |
| Key Features | Room-temperature latency, thermal activation >120 °C, halogen-free |
| Recommended Storage | Below 25 °C, dry and sealed conditions |
| Shelf Life | 12 months under recommended storage conditions |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
