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High-purity dicyandiamide formulation optimized for consistent epoxy cure performance and low volatility.
Enhanced thermal stability enabling elevated processing temperatures without premature decomposition.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Precise particle size distribution for uniform dispersion and reduced sedimentation in formulated systems.
Low residual moisture content (<0.1 wt%) to minimize gelation risk during storage and handling.
Aerospace composite tooling and structural adhesives requiring high glass transition temperature (Tg).
Electrical laminates and printed circuit board (PCB) prepregs demanding dimensional stability and flame retardancy.
Automotive under-hood components exposed to sustained thermal cycling.
Wind turbine blade bonding adhesives requiring long pot life and robust post-cure mechanical properties.
Industrial coatings for corrosion-resistant metal substrates in harsh chemical environments.
| Chemical Type | Dicyandiamide (DICY) |
| Product Form | Fine white crystalline powder |
| Appearance | Free-flowing, odorless white powder |
| Primary Applications | Epoxy resin curing agent for high-performance composites and adhesives |
| Key Features | Controlled particle size, low moisture, high purity, thermal stability |
| Recommended Cure Schedule | 150–180 °C for 1–4 hours (varies by resin system) |
| Storage Conditions | Store in original sealed container at 15–25 °C; protect from moisture |
| Shelf Life | 24 months from date of manufacture when stored properly |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
