Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KS Chemical Hiblock BI-175 Curing Agent

KSChemicalHiblockBI-175CuringAgentisahigh-performancealiphaticpolyaminehardenerfromtheHiblockseries,designedforepoxyresinsrequiringexcellentchemicalresistance,lowcolorformation,andfastroom-temperaturecure.Itofferssuperioradhesion,flexibility,andUVstability,makingitidealforcoatings,adhesives,andcompositesinautomotiveandindustrialapplications.
  • ks chemical hiblock bi 175 curing agent_e277ab07
  • ks chemical hiblock bi 175 curing agent_e277ab07

Features Of KS Chemical Hiblock BI-175 Curing Agent

  1. Low-viscosity liquid formulation for excellent processability and easy metering.

  2. Fast ambient-cure kinetics with robust crosslink density development.

  3. Superior chemical resistance to hydrocarbons, solvents, and weak acids.

  4. Enhanced adhesion to metals, composites, and thermoset substrates.

  5. Halogen-free and REACH-compliant for sustainable industrial use.

Typical Applications Of KS Chemical Hiblock BI-175 Curing Agent

  1. Aerospace composite bonding and repair systems.

  2. High-performance automotive under-hood encapsulants and potting compounds.

  3. Electronics encapsulation for power modules and EV battery components.

  4. Industrial coatings requiring rapid turnaround and chemical durability.

  5. Wind turbine blade adhesive and structural reinforcement formulations.

Specifications Of KS Chemical Hiblock BI-175 Curing Agent

Chemical TypeAmine-based aliphatic polyfunctional curing agent
Product FormClear to pale yellow liquid
AppearanceHomogeneous, low-viscosity liquid at 25°C
Primary ApplicationsEpoxy resin curing for structural adhesives and composites
Key FeaturesRoom-temperature cure capability; low exotherm profile
BenefitsImproved Tg build-up, reduced shrinkage, and extended pot life vs. conventional amines
Storage Stability12 months at 20–25°C in sealed original container
Hazard ClassificationNot classified as hazardous per GHS (non-corrosive, non-sensitizing)


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