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Enhanced pot life extension for improved processing window in ambient-cure epoxy systems.
Optimized reactivity profile enabling balanced gel time and full cure development at room temperature.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Low viscosity formulation facilitating easy handling, metering, and homogeneous mixing.
Improved chemical resistance in cured films, particularly against alkalis and mild solvents.
Industrial maintenance coatings for steel structures and concrete substrates.
Electrical encapsulation and potting compounds for medium-voltage components.
Adhesives and structural bonding agents in transportation equipment assembly.
Flooring systems requiring rapid return-to-service under ambient conditions.
Repair mortars and grouts for infrastructure rehabilitation projects.
| Chemical Type | Polyamide-modified amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Viscosity (25 °C) | 800–1,200 mPa·s |
| Amine Value | 220–260 mg KOH/g |
| Density (20 °C) | 0.94–0.97 g/cm³ |
| Primary Applications | Epoxy coating, adhesive, and flooring systems |
| Key Features | Room-temperature cure, extended working time, low exotherm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
