Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DER 663UE Solid Epoxy Resin

Dow DER 663UE Solid Epoxy Resin is a high-purity, low-bromine bisphenol-A based epoxy resin from Dow’s DER™ series. Designed for demanding electrical encapsulation and powder coating applications, it offers excellent thermal stability, low ionic impurities, and consistent melt viscosity. Its ultra-low chlorine content ensures superior dielectric performance and reliability in high-voltage electronics and LED packaging.
  • dow der 663ue solid epoxy resin_2d5b48ce
  • dow der 663ue solid epoxy resin_2d5b48ce

Features Of Dow DER 663UE Solid Epoxy Resin

  1. High-purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.

  2. Excellent thermal stability and low volatile organic compound (VOC) content for compliant processing.

  3. Optimized melt viscosity for improved flow and wetting in powder coating and casting formulations.

  4. Superior adhesion to metals, composites, and cured polymer substrates.

  5. Enhanced chemical resistance—particularly to alkalis, solvents, and mild acids after full cure.

Typical Applications Of Dow DER 663UE Solid Epoxy Resin

  1. Powder coatings for architectural aluminum, appliances, and automotive components.

  2. Electrical encapsulation and potting compounds for transformers, sensors, and PCBs.

  3. High-performance composite matrices in wind turbine blades and aerospace secondary structures.

  4. Adhesives and structural bonding systems requiring elevated Tg and dimensional stability.

  5. UV-curable hybrid systems where solid epoxy provides backbone rigidity and crosslink density.

Specifications Of Dow DER 663UE Solid Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA) epoxy resin
Product FormOff-white to pale yellow solid flakes or pellets
AppearanceFree-flowing, homogeneous solid with minimal dust generation
Epoxy Equivalent Weight (EEW)475–495 g/eq
Melt Viscosity (150 °C)8,000–12,000 cP
Glass Transition Temperature (Tg)65–72 °C (uncured)
Softening Point78–85 °C (ring-and-ball method)
Volatiles Content<0.3 wt% at 125 °C for 2 hours


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