High-purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content for compliant processing.
Optimized melt viscosity for improved flow and wetting in powder coating and casting formulations.
Superior adhesion to metals, composites, and cured polymer substrates.
Enhanced chemical resistance—particularly to alkalis, solvents, and mild acids after full cure.
Powder coatings for architectural aluminum, appliances, and automotive components.
Electrical encapsulation and potting compounds for transformers, sensors, and PCBs.
High-performance composite matrices in wind turbine blades and aerospace secondary structures.
Adhesives and structural bonding systems requiring elevated Tg and dimensional stability.
UV-curable hybrid systems where solid epoxy provides backbone rigidity and crosslink density.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Off-white to pale yellow solid flakes or pellets |
| Appearance | Free-flowing, homogeneous solid with minimal dust generation |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melt Viscosity (150 °C) | 8,000–12,000 cP |
| Glass Transition Temperature (Tg) | 65–72 °C (uncured) |
| Softening Point | 78–85 °C (ring-and-ball method) |
| Volatiles Content | <0.3 wt% at 125 °C for 2 hours |
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E-mail: wangxingqiang@ericwchem.com
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