Highly transparent, low-viscosity silicone gel with excellent clarity and UV stability.
Non-corrosive formulation compatible with sensitive electronic components and metals.
Thermally stable across a wide operating range (–50 °C to 200 °C).
Low surface tension and superior conformal coating capability for complex geometries.
Cures at room temperature via moisture-cure mechanism—no heat or catalyst required.
Encapsulation and protection of LED modules and drivers.
Dielectric insulation for power electronics and high-voltage components.
Stress-relieving potting compound for sensors and automotive control units.
Optical bonding and light-guide adhesion in display and lighting assemblies.
Moisture barrier for PCBs exposed to harsh industrial or outdoor environments.
| Chemical Type | Alkoxy-cured polydimethylsiloxane (PDMS) gel |
| Product Form | One-component, flowable liquid gel |
| Appearance | Clear, colorless, viscous liquid |
| Primary Applications | Electronic encapsulation, optical bonding, thermal management |
| Key Features | Room-temperature cure, non-corrosive, ultra-low modulus |
| Benefits | Reduces mechanical stress, enhances long-term reliability, improves thermal cycling performance |
| Shelf Life (unopened) | 12 months at 25 °C in original sealed container |
| VOC Content | Non-VOC compliant per ASTM D3960 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China