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Engineered silicone-based formulation offering excellent thermal stability across a wide operating temperature range.
Provides superior electrical insulation properties with low dielectric loss and high volume resistivity.
Designed for easy processing—exhibits good flow characteristics and compatibility with common industrial mixing and dispensing equipment.
Offers outstanding resistance to moisture, ozone, UV radiation, and aging under harsh environmental conditions.
Non-corrosive to metals and compatible with various elastomers and plastics commonly used in electronic and industrial assemblies.
Encapsulation and potting of power electronics, including IGBT modules and LED drivers.
Thermal interface material (TIM) for heat dissipation in electric vehicle battery management systems (BMS).
Protective coating for sensors and control units exposed to high-temperature or high-humidity environments.
Dielectric filling compound in high-voltage transformers and renewable energy inverters.
Sealing and bonding component in aerospace avionics housings requiring long-term reliability.
| Chemical Type | Heat-curable silicone polymer blend |
| Product Form | Paste (two-component, A+B system) |
| Appearance | Off-white to light gray viscous paste |
| Primary Applications | Electrical encapsulation, thermal management, protective coating |
| Key Features | High thermal stability, low ionic impurities, UL 94 V-0 rated (cured) |
| Benefits | Extended service life in demanding environments, reduced risk of electrochemical migration |
| Cure System | Platinum-catalyzed addition cure |
| Storage Conditions | 2–8 °C; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
