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Two-component, addition-cure silicone adhesive offering low modulus and high elongation for stress relief in dynamic assemblies.
Excellent adhesion to a wide range of substrates including metals, glass, ceramics, and engineered plastics without primers.
UL 94 V-0 rated for flame retardancy, supporting compliance in safety-critical electronic and automotive applications.
Low outgassing and high purity formulation, suitable for use in vacuum environments and sensitive optical/electronic modules.
Wide service temperature range from −55 °C to +200 °C with long-term thermal stability and minimal compression set.
Encapsulation and bonding of LED lighting components and drivers.
Structural assembly of automotive sensors, ECUs, and power electronics housings.
Adhesive bonding in aerospace avionics enclosures requiring vibration damping and thermal cycling resistance.
Assembly of medical diagnostic devices where biocompatibility and low extractables are critical.
Sealing and bonding of solar inverter modules exposed to outdoor UV and humidity.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Two-component liquid (Part A: base; Part B: catalyst) |
| Appearance | Opaque white paste (Part A), translucent off-white paste (Part B) |
| Primary Applications | Bonding, sealing, and potting in electronics, automotive, and industrial equipment |
| Key Features | Low modulus, high elongation, flame retardant (UL 94 V-0), low outgassing |
| Shore A Hardness (7 days @ 23 °C) | 25–30 |
| Elongation at Break (ASTM D412) | ≥ 250% |
| Cure Schedule (typical) | 2 hrs @ 100 °C or 24 hrs @ 23 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
