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High thermal conductivity (1.6 W/m·K) for efficient heat dissipation in demanding electronic environments.
Excellent electrical insulation properties with high dielectric strength and volume resistivity.
Low modulus and high conformability enable stress relief and reliable interface contact on uneven surfaces.
Thermally stable silicone elastomer formulation, operating continuously from –50 °C to 200 °C.
Ready-to-use two-part addition-cure system with low mixed viscosity and extended pot life for automated dispensing.
Thermal interface material (TIM) between power semiconductors and heat sinks in EV inverters and onboard chargers.
Die-attach and underfill encapsulation for high-power LED modules requiring long-term thermal cycling reliability.
Gap-filling pads and form-in-place (FIP) gaskets for battery management systems (BMS) and DC-DC converters.
Thermal management solutions in renewable energy power electronics, including solar inverters and wind turbine controllers.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Opaque gray paste (Part A); translucent light yellow liquid (Part B) |
| Primary Applications | Thermal interface materials, gap fillers, conformal thermal gaskets |
| Key Features | High thermal conductivity, low compression set, flame retardant (UL 94 V-0 rated) |
| Benefits | Improved device reliability, reduced thermal resistance, simplified assembly process |
| Cure System | Room temperature or elevated temperature (80–150 °C) addition cure |
| Shelf Life (Unopened) | 12 months at ≤25 °C in original sealed packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
