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High thermal conductivity (2.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Excellent electrical insulation properties with low dielectric loss across wide temperature and frequency ranges.
Ready-to-use two-part addition-cure formulation with low viscosity and excellent flowability for precise dispensing and void-free encapsulation.
Outstanding long-term stability — maintains mechanical integrity and thermal performance after prolonged exposure to elevated temperatures (up to 200 °C).
Low compression set and high elasticity, ensuring reliable sealing and stress relief on sensitive components over time.
Thermal interface material (TIM) for power modules, IGBTs, and LED drivers.
Encapsulation and potting of high-power electronics, including EV onboard chargers and DC-DC converters.
Gap-filling pads and form-in-place gaskets for battery management systems (BMS) and energy storage units.
Dielectric protection layer for automotive sensors operating under harsh under-hood conditions.
Thermally conductive bonding and cushioning in renewable energy inverters and solar microinverters.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Opaque off-white viscous liquid (Part A); translucent pale yellow liquid (Part B) |
| Primary Applications | Thermal management, electrical insulation, vibration damping, and environmental sealing |
| Key Features | High thermal conductivity, low modulus, flame retardant (UL 94 V-0), RoHS compliant |
| Shore A Hardness (7 days @ 25 °C) | 35 ± 3 |
| Cure Schedule | 20 min @ 100 °C or 24 h @ 25 °C |
| Storage Stability (unopened) | 12 months @ ≤25 °C (refrigeration recommended for extended shelf life) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
