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High thermal conductivity (2.6 W/m·K) for efficient heat dissipation in power electronics.
Excellent electrical insulation properties with high dielectric strength and volume resistivity.
Low modulus and high conformability enable stress relief and reliable interface bonding on irregular surfaces.
Thermally stable across -50 °C to +200 °C, maintaining performance under extended thermal cycling.
Non-corrosive, halogen-free formulation compliant with RoHS and REACH requirements.
Thermal interface material (TIM) for IGBT modules and power inverters in electric vehicles.
Heat transfer pad between CPUs/GPUs and heatsinks in industrial computing and 5G infrastructure.
Die-attach and gap-filling compound for LED drivers and photovoltaic inverters.
Thermal management layer in battery module cooling plates and energy storage systems.
Interface material for semiconductor packaging requiring long-term reliability under thermal shock.
| Chemical Type | Platinum-cured silicone elastomer |
| Product Form | Pre-formed solid sheet (available in various thicknesses and custom die-cut shapes) |
| Appearance | Opaque gray, flexible rubber sheet |
| Thermal Conductivity | 2.6 W/m·K (ASTM D5470) |
| Density | 2.1 g/cm³ (ASTM D792) |
| Hardness (Shore A) | 45 ± 5 (ASTM D2240) |
| Dielectric Strength | ≥18 kV/mm (ASTM D149) |
| Volume Resistivity | ≥1 × 10¹⁵ Ω·cm (ASTM D257) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
