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High thermal conductivity (2.2 W/m·K) for efficient heat dissipation in demanding electronic applications.
Excellent electrical insulation properties with high dielectric strength and low dielectric loss.
Low modulus and soft consistency enabling conformal contact and stress relief on sensitive components.
Room-temperature vulcanization (RTV) with rapid, one-part cure—no mixing required.
UL 94 V-0 rated for flame retardancy, supporting safety-critical designs.
Thermal interface material (TIM) between power semiconductors and heat sinks in EV inverters and onboard chargers.
Dielectric encapsulation for high-voltage battery management systems (BMS) and DC-DC converters.
Gap-filling compound for LED lighting modules requiring both thermal management and electrical isolation.
Underfill and potting solution for automotive ADAS sensors and radar assemblies exposed to wide temperature swings.
| Chemical Type | Platinum-catalyzed addition-cure silicone rubber |
| Product Form | Paste, single-component |
| Appearance | Off-white, homogeneous paste |
| Primary Applications | Thermal interface materials, electrical insulation, gap filling |
| Key Features | High thermal conductivity, RTV cure, UL 94 V-0 rated, low compression set |
| Benefits | Reduces thermal resistance, simplifies assembly, enhances long-term reliability under thermal cycling |
| Cure Mechanism | Platinum-catalyzed hydrosilylation at room temperature |
| Operating Temperature Range | –40 °C to +200 °C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
