Reactive liquid modifier that chemically bonds into epoxy networks, enhancing toughness without sacrificing thermal stability.
Enables significant improvement in impact resistance and fracture toughness (KIC) of cured epoxy systems.
Low viscosity and excellent compatibility with standard DGEBA and novolac epoxy resins, facilitating easy incorporation.
Maintains high glass transition temperature (Tg) of the base epoxy formulation after curing.
Reduces microcracking under thermal cycling and mechanical stress, improving long-term reliability.
Aerospace composite matrices for primary and secondary structural components.
High-performance electrical encapsulants and potting compounds for power electronics.
Advanced adhesives used in automotive lightweighting and EV battery module bonding.
Wind turbine blade resin systems requiring fatigue resistance and delamination suppression.
Industrial tooling and mold-making epoxies demanding dimensional stability and crack resistance.
| Chemical Type | Reactive carboxyl-terminated polybutadiene (CTPB) derivative |
| Product Form | Liquid |
| Appearance | Pale yellow to light amber, clear liquid |
| Viscosity (25°C) | 800–1,200 cP |
| Active Hydrogen Equivalent Weight | ~420–460 g/eq |
| Primary Applications | Epoxy toughening for structural composites, adhesives, and encapsulants |
| Key Features | Reactive toughening, low volatility, no phase separation in compatible systems |
| Benefits | Improved impact strength, reduced brittleness, retained Tg and modulus |
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E-mail: wangxingqiang@ericwchem.com
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