Ultra-pure water (UPW) grade resin specifically engineered for semiconductor and pharmaceutical ultrapure water systems.
Highly crosslinked gel-type strong acid cation exchange resin with exceptional chemical stability in aggressive regeneration environments.
Low total organic carbon (TOC) extractables to minimize downstream contamination risk in critical UPW applications.
Consistent spherical bead morphology ensures uniform hydraulic performance and low pressure drop across service cycles.
Optimized for high-efficiency sodium leakage control and rapid regeneration kinetics in mixed-bed polishing configurations.
Final polishing stage in ultrapure water (UPW) systems for semiconductor wafer fabrication facilities.
Pharmaceutical water-for-injection (WFI) and purified water (PW) production systems requiring USP/EP compliance.
Mixed-bed ion exchange units in high-purity power plant boiler feedwater treatment.
Critical microelectronics manufacturing processes where sub-part-per-trillion ionic contamination limits apply.
Research-grade laboratory water purification systems demanding ultra-low conductivity and silica rejection.
| Chemical Type | Strong Acid Cation (SAC), sulfonated polystyrene-divinylbenzene copolymer |
| Product Form | Moist, spherical beads (H⁺ form) |
| Appearance | Amber, translucent, uniform spherical beads |
| Functional Group | Sulfonic acid (–SO₃H) |
| Ion Exchange Capacity (min.) | 1.9 eq/L (dry basis) |
| Moisture Content (as shipped) | 45–50% (w/w) |
| Particle Size Range | 0.3–1.2 mm (95% retained on 0.3 mm sieve) |
| Uniformity Coefficient (max.) | 1.6 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China