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High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone elastomer enabling conformal contact with uneven or delicate surfaces.
Excellent long-term reliability under thermal cycling and elevated temperature exposure.
Electrically insulating formulation to prevent short circuits while managing heat.
Ready-to-use two-part liquid system with low viscosity for precise dispensing and automated processing.
Thermal interface material (TIM) for power electronics, including IGBT modules and inverters.
Heat transfer padding between LED packages and metal-core printed circuit boards (MCPCBs).
Conformal thermal gap filler for battery module cooling in electric vehicles (EVs) and energy storage systems.
Die-attach and heat-spreading layer for high-power semiconductor devices operating above 125 °C.
Soft encapsulation and thermal management for sensitive sensors and optoelectronic components.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Opaque gray liquid (Part A), colorless to pale yellow liquid (Part B) |
| Primary Applications | Thermal interface material, gap filler, conformal heat transfer pad |
| Key Features | Thermally conductive, electrically insulating, low modulus, flame retardant (UL 94 V-0 rated) |
| Benefits | Reduces thermal resistance, accommodates CTE mismatch, enables automated dispensing, supports reworkability |
| Cure System | Room temperature or elevated temperature (80–125 °C) addition cure |
| Shelf Life | 12 months at 25 °C unopened; refrigerated storage recommended for extended stability |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
