English
Español
tiếng việt
русский
High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone elastomer enabling conformal contact with uneven or delicate surfaces.
Excellent long-term reliability under thermal cycling and elevated temperature exposure.
Electrically insulating formulation to prevent short circuits while managing heat.
Ready-to-use two-part liquid system with low viscosity for precise dispensing and automated processing.
Thermal interface material (TIM) for power electronics, including IGBT modules and inverters.
Heat transfer padding between LED packages and metal-core printed circuit boards (MCPCBs).
Conformal thermal gap filler for battery module cooling in electric vehicles (EVs) and energy storage systems.
Die-attach and heat-spreading layer for high-power semiconductor devices operating above 125 °C.
Soft encapsulation and thermal management for sensitive sensors and optoelectronic components.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Opaque gray liquid (Part A), colorless to pale yellow liquid (Part B) |
| Primary Applications | Thermal interface material, gap filler, conformal heat transfer pad |
| Key Features | Thermally conductive, electrically insulating, low modulus, flame retardant (UL 94 V-0 rated) |
| Benefits | Reduces thermal resistance, accommodates CTE mismatch, enables automated dispensing, supports reworkability |
| Cure System | Room temperature or elevated temperature (80–125 °C) addition cure |
| Shelf Life | 12 months at 25 °C unopened; refrigerated storage recommended for extended stability |
Q1: What is the primary function of SYLGARD 3-6605 in thermal management applications?
A: SYLGARD 3-6605 is a thermally conductive silicone elastomer designed to fill microscopic air gaps between heat-generating components and heat sinks or cold plates, thereby enhancing heat transfer efficiency while maintaining electrical insulation and mechanical compliance.
Q2: How does SYLGARD 3-6605 differ from standard non-conductive silicone gels or pads?
A: Unlike conventional silicone gels, SYLGARD 3-6605 incorporates thermally conductive fillers that provide significantly higher through-plane thermal conductivity while retaining low modulus, excellent conformability, and long-term stability under thermal cycling—making it especially suited for dynamic or high-reliability electronics assemblies.
Q3: Is SYLGARD 3-6605 suitable for automated dispensing processes?
A: Yes, SYLGARD 3-6605 is formulated for compatibility with standard precision dispensing equipment, including needle-based and jetting systems. Its rheology supports controlled deposition, minimal slump, and consistent cure performance across typical production line conditions.
Q4: What are the recommended curing conditions for optimal performance?
A: SYLGARD 3-6605 cures at room temperature over time, but accelerated cure is achieved with mild thermal exposure—typically at 60–80 °C for 30–90 minutes. Full property development, including thermal and mechanical stability, is realized after post-cure at elevated temperatures as specified in the technical data sheet.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
