Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow XIAMETER RBB-2004-40 Silicone Rubber

Dow XIAMETER® RBB-2004-40 is a high-strength, heat-curable liquid silicone rubber (LSR) offering excellent flow, low viscosity, and consistent cure performance. Designed for precision injection molding, it delivers superior mechanical properties, thermal stability, and biocompatibility—ideal for medical devices, automotive seals, and consumer electronics components.
  • dow xiameter rbb 2004 40 silicone rubber_5b07b5fa
  • dow xiameter rbb 2004 40 silicone rubber_5b07b5fa

Features Of Dow XIAMETER RBB-2004-40 Silicone Rubber

  1. High-temperature stability up to 200 °C for extended service life in demanding thermal environments.

  2. Excellent compression set resistance, maintaining sealing integrity after prolonged deformation.

  3. Good processability with low viscosity and extended pot life for efficient mixing and dispensing.

  4. Platinum-catalyzed addition cure system enabling precise control over cure kinetics and minimal byproduct formation.

  5. UL 94 HB flammability rating and compliance with RoHS and REACH directives for regulated industries.

Typical Applications Of Dow XIAMETER RBB-2004-40 Silicone Rubber

  1. Automotive under-hood gaskets and vibration-damping mounts.

  2. Industrial fluid-handling seals for pumps, valves, and connectors.

  3. Electrical insulation components in power distribution and control systems.

  4. Medical device housings and non-invasive sensor encapsulants (subject to biocompatibility validation).

Specifications Of Dow XIAMETER RBB-2004-40 Silicone Rubber

Chemical TypePlatinum-catalyzed addition-cure liquid silicone rubber (LSR)
Product FormTwo-part liquid system (Part A: base; Part B: catalyst)
Appearance (Part A)Translucent, low-viscosity liquid
Appearance (Part B)Translucent, low-viscosity liquid
Mix Ratio (A:B) by Weight10:1
Cure Temperature Range100–180 °C (time-dependent)
Shore A Hardness (Cured)40 ± 3
Primary ApplicationsSealing, gasketing, encapsulation, and vibration damping


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