Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow XIAMETER RBB-2070-60 Silicone Rubber

Dow XIAMETER® RBB-2070-60 is a high-strength, platinum-cured liquid silicone rubber (LSR) offering excellent flow, low viscosity, and rapid cure for precision molding. Ideal for medical devices, seals, and automotive parts, it delivers superior biocompatibility, thermal stability, and mechanical resilience with minimal shrinkage and consistent replication.
  • dow xiameter rbb 2070 60 silicone rubber_34b94474
  • dow xiameter rbb 2070 60 silicone rubber_34b94474

Features Of Dow XIAMETER RBB-2070-60 Silicone Rubber

  1. High-consistency, two-part addition-cure silicone rubber with excellent processability in compression and transfer molding.

  2. Offers outstanding thermal stability and long-term performance across –60 °C to 200 °C operating range.

  3. Low compression set and superior mechanical properties, including high tensile strength and elongation at break.

  4. Excellent electrical insulation properties and low dielectric loss, suitable for high-reliability electronic applications.

  5. Meets UL 94 V-0 flammability rating and complies with RoHS and REACH regulatory requirements.

Typical Applications Of Dow XIAMETER RBB-2070-60 Silicone Rubber

  1. Seals and gaskets for automotive powertrain and under-hood components.

  2. Insulators and protective housings for power electronics and EV battery modules.

  3. Medical device components requiring biocompatibility support (ISO 10993 testing available upon request).

  4. Industrial fluid handling parts exposed to oils, coolants, and ozone.

  5. Consumer appliance seals requiring food-contact compliance (FDA extractables data available).

Specifications Of Dow XIAMETER RBB-2070-60 Silicone Rubber

Chemical TypePlatinum-catalyzed addition-cure silicone elastomer
Product FormTwo-part liquid system (Part A: base; Part B: catalyst)
AppearanceOpaque, viscous paste (Part A); translucent, low-viscosity liquid (Part B)
Primary ApplicationsHigh-performance sealing, encapsulation, and structural bonding
Key FeaturesLow shrinkage, minimal post-cure distortion, excellent flow control
BenefitsReduced scrap rate, consistent part dimensional accuracy, extended mold life
Curing MethodHeat-cured (150 °C for 5–10 minutes typical)
Shelf Life12 months unopened at ≤25 °C (Part A); 6 months unopened at ≤25 °C (Part B)


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