Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow XIAMETER RBL-2004-20 Silicone Rubber

Dow XIAMETER RBL-2004-20 is a high-consistency, two-part platinum-cured silicone rubber offering excellent mechanical strength, thermal stability up to 200°C, and low compression set. Ideal for demanding industrial molding, gasketing, and sealing applications requiring precision, durability, and FDA-compliant formulation.
  • dow xiameter rbl 2004 20 silicone rubber_066bc346
  • dow xiameter rbl 2004 20 silicone rubber_066bc346

Features Of Dow XIAMETER RBL-2004-20 Silicone Rubber

  1. High-consistency, two-part addition-cure silicone rubber with excellent processability in compression and transfer molding.

  2. Offers outstanding thermal stability and long-term performance across a wide operating temperature range (–55 °C to 200 °C).

  3. Low compression set and superior mechanical properties, including high tensile strength and elongation at break.

  4. Excellent electrical insulation properties and resistance to weathering, ozone, and UV exposure.

  5. Meets ISO 10993-5 biocompatibility requirements for medical device applications.

Typical Applications Of Dow XIAMETER RBL-2004-20 Silicone Rubber

  1. Medical-grade seals, gaskets, and tubing components for diagnostic and therapeutic devices.

  2. Automotive under-hood components requiring thermal and chemical resistance.

  3. Industrial sealing systems exposed to extreme environmental conditions.

  4. Consumer electronics housings and protective elastomeric interfaces.

  5. Food-contact compliant parts in processing and packaging equipment.

Specifications Of Dow XIAMETER RBL-2004-20 Silicone Rubber

Chemical TypePlatinum-catalyzed addition-cure silicone rubber
Product FormTwo-part liquid system (Part A: base; Part B: catalyst)
AppearanceOpaque, viscous paste (Part A); translucent liquid (Part B)
Shore A Hardness (7 days @ 23 °C)40 ± 3
Tensile Strength (ASTM D412)8.5 MPa (min)
Elongation at Break (ASTM D412)450% (min)
Compression Set (22 h @ 150 °C, ASTM D395 B)≤ 25%
Curing SystemRoom temperature or elevated temperature (e.g., 10–30 min @ 150 °C)


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