Ultra-low ionic and metallic impurity content, meeting stringent ISO Class 1–5 cleanroom requirements.
Acetoxy-cure silicone chemistry enabling rapid room-temperature cure with minimal volatile byproducts.
Excellent adhesion to glass, stainless steel, anodized aluminum, and common cleanroom plastics without primer.
Non-corrosive to sensitive electronic components and optical surfaces after full cure.
Compliant with SEMI F57 and ASTM D3405 standards for semiconductor-grade sealants.
Sealing and bonding of HEPA/ULPA filter frames in pharmaceutical and biotech cleanrooms.
Assembly of wafer handling fixtures and photomask storage cabinets in semiconductor fabrication facilities.
Mounting of precision optics and sensors in analytical instrumentation used in controlled environments.
Bonding of laminar flow hood components and glovebox viewports requiring particle-free integrity.
| Chemical Type | Acetoxy-curing silicone polymer |
| Product Form | Thixotropic paste, single-component |
| Appearance | Off-white, uniform paste |
| Primary Applications | Cleanroom sealing, bonding, and gasketing |
| Key Features | Low outgassing, non-corrosive, ultra-low sodium/potassium/chloride |
| Benefits | Minimizes particle generation and surface contamination in critical environments |
| Cure Mechanism | Moisture-cured at ambient temperature |
| Storage Stability | 12 months unopened at 5–25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China