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High-purity dicyandiamide (DICY) formulation optimized for consistent epoxy resin curing performance.
Enhanced thermal stability enabling reliable processing in elevated-temperature cure cycles.
Low dust generation and improved handling safety compared to conventional DICY grades.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Enables extended pot life at ambient temperatures while maintaining rapid gelation upon heating.
Electrical laminates for printed circuit boards (PCBs) requiring high Tg and dimensional stability.
Structural adhesives in automotive and aerospace composites.
Encapsulants and potting compounds for power electronics and LED modules.
Coating systems for metal substrates demanding chemical resistance and thermal endurance.
Powder coatings requiring low-bake, high-performance crosslinking.
| Chemical Type | Dicyandiamide (DICY) |
| Product Form | Free-flowing white crystalline powder |
| Appearance | White to off-white fine crystalline solid |
| Primary Applications | Epoxy resin curing agent for thermosets |
| Key Features | Thermal latency, low volatility, high reactivity upon heating |
| Benefits | Improved storage stability, reduced blooming, enhanced mechanical properties in cured networks |
| Recommended Cure Profile | 150–180 °C for 30–90 minutes |
| Storage Conditions | Store in cool, dry place; protect from moisture and direct sunlight |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
