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High-purity dicyandiamide (DICY) formulation optimized for consistent epoxy resin curing performance.
Enhanced thermal stability enabling reliable processing in elevated-temperature cure cycles.
Low dust generation and improved handling safety compared to conventional DICY grades.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Enables extended pot life at ambient temperatures while maintaining rapid gelation upon heating.
Electrical laminates for printed circuit boards (PCBs) requiring high Tg and dimensional stability.
Structural adhesives in automotive and aerospace composites.
Encapsulants and potting compounds for power electronics and LED modules.
Coating systems for metal substrates demanding chemical resistance and thermal endurance.
Powder coatings requiring low-bake, high-performance crosslinking.
| Chemical Type | Dicyandiamide (DICY) |
| Product Form | Free-flowing white crystalline powder |
| Appearance | White to off-white fine crystalline solid |
| Primary Applications | Epoxy resin curing agent for thermosets |
| Key Features | Thermal latency, low volatility, high reactivity upon heating |
| Benefits | Improved storage stability, reduced blooming, enhanced mechanical properties in cured networks |
| Recommended Cure Profile | 150–180 °C for 30–90 minutes |
| Storage Conditions | Store in cool, dry place; protect from moisture and direct sunlight |
Q1: What is the primary function of AMICURE CG-1200 in epoxy systems?
A: AMICURE CG-1200 is a dicyandiamide-based latent curing agent designed to provide controlled reactivity in one-component epoxy formulations. It enables extended pot life at ambient temperatures while delivering efficient thermal cure upon heating, making it suitable for powder coatings, prepregs, and film adhesives.
Q2: How does AMICURE CG-1200 compare to standard dicyandiamide in terms of handling and dispersion?
A: Unlike conventional dicyandiamide, CG-1200 is supplied as a specially surface-treated, free-flowing powder with improved wettability and dispersion stability in epoxy resins. This reduces agglomeration during mixing and supports more uniform cure performance without requiring high-shear processing.
Q3: What is the typical activation temperature range for AMICURE CG-1200?
A: Full reactivity generally begins above 130 °C, with practical cure profiles commonly applied between 140 °C and 180 °C. The exact onset and rate depend on epoxy resin type, formulation additives, and thermal history — users are advised to optimize via DSC analysis and gel time testing.
Q4: Is AMICURE CG-1200 compatible with common epoxy resins used in electrical encapsulation?
A: Yes — CG-1200 demonstrates good compatibility with standard bisphenol-A and bisphenol-F based liquid and solid epoxies, as well as novolac epoxies. Its low volatility and latent behavior support void-free curing in sensitive electronic applications where outgassing and premature reaction must be minimized.
Q5: What storage conditions are recommended to maintain product stability?
A: Store in original sealed packaging under cool, dry conditions (below 25 °C and <50% relative humidity). Prolonged exposure to moisture or elevated temperatures may reduce latency and affect shelf life. Once opened, use promptly and reseal tightly to prevent caking or reactivity loss.
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E-mail: wangxingqiang@ericwchem.com
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