High reactivity with epoxy resins at ambient and elevated temperatures.
Enables fast gelation and short demolding times in structural adhesives and composites.
Provides excellent thermal stability and long-term performance in cured systems.
Low volatility and low skin sensitization potential compared to traditional amine hardeners.
Compatible with standard epoxy formulations without requiring solvents or modifiers.
Structural adhesives for automotive and aerospace bonding.
Electrical encapsulation compounds for power electronics and LED modules.
Wind turbine blade matrix resins and composite tooling materials.
High-performance coatings for industrial flooring and corrosion protection.
Pultrusion and filament winding resins for reinforced polymer profiles.
| Chemical Type | Urea-based latent curing agent |
| Product Form | Free-flowing white granular solid |
| Appearance | Off-white to light beige granules |
| Primary Applications | Epoxy resin curing for adhesives, composites, and encapsulants |
| Key Features | Latent reactivity, low dust generation, high thermal stability |
| Benefits | Extended pot life, rapid cure onset, improved worker safety |
| Storage Conditions | Store in original sealed container at 5–25 °C, protect from moisture |
| Shelf Life | 24 months from date of manufacture under recommended storage |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China