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Flexible and tough cured epoxy systems with excellent impact resistance.
Low viscosity enables easy handling, good flow, and improved wetting of fillers and reinforcements.
Extended pot life at ambient temperature for improved processing window in large-part or multi-component applications.
Good adhesion to metals, concrete, and composite substrates without aggressive surface pretreatment.
Low odor and low volatility formulation supports safer industrial handling and compliance with VOC regulations.
Structural adhesives for automotive and transportation assembly.
Epoxy-based flooring and industrial coatings for warehouses and manufacturing facilities.
Electrical encapsulation and potting compounds for transformers and power electronics.
Composite matrix resins for wind turbine blades and aerospace secondary structures.
Repair mortars and polymer-modified grouts for civil engineering infrastructure.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown transparent liquid |
| Viscosity (25 °C) | 1,800–2,500 mPa·s |
| Amine Value | 230–260 mg KOH/g |
| Reactivity Profile | Medium-reactive polyamide curing agent |
| Primary Applications | Epoxy resin curing for adhesives, coatings, and composites |
| Key Features | Flexibility, low-temperature cure capability, low exotherm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
