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Low-viscosity liquid polyamide offering excellent compatibility with standard epoxy resins.
Enables ambient-temperature curing with good pot life and extended working time.
Delivers high flexibility, impact resistance, and adhesion to diverse substrates including metals and concrete.
Provides improved chemical resistance—particularly to alkalis, salts, and mild solvents—after full cure.
Free of volatile organic compounds (VOC-free), supporting sustainable coating and adhesive formulations.
Industrial maintenance coatings for steel structures and pipelines.
Concrete floor coatings and protective overlays in commercial and industrial facilities.
Two-component epoxy adhesives for metal-to-metal and metal-to-composite bonding.
Marine and offshore protective coatings requiring corrosion resistance and flexibility.
Electrical encapsulation and potting compounds where toughness and dielectric stability are critical.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown, clear to slightly hazy liquid |
| Amine Value | 220–250 mg KOH/g |
| Viscosity (25 °C) | 1,500–3,000 mPa·s |
| Density (20 °C) | 0.94–0.97 g/cm³ |
| Primary Applications | Epoxy resin curing agent for coatings, adhesives, and composites |
| Key Features | Ambient-cure capability, low VOC, flexible cured film, substrate versatility |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
