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Latent at room temperature — enables extended pot life and ambient storage stability.
Activates rapidly upon heating — delivers efficient epoxy resin curing above 120 °C.
Low volatility and low odor — supports safer handling and improved workplace air quality.
Excellent compatibility with standard diglycidyl ether of bisphenol-A (DGEBA) resins.
Yields high glass transition temperature (Tg) cured networks with superior thermal and mechanical performance.
Aerospace composite prepregs requiring precise cure scheduling and out-time control.
Electrical laminates for printed circuit boards (PCBs) demanding high Tg and dimensional stability.
Automotive under-hood components requiring resistance to sustained thermal cycling.
Wind turbine blade structural adhesives and matrix resins for elevated service temperatures.
High-performance tooling and casting compounds where low exotherm and controlled reactivity are critical.
| Chemical Type | Dicyandiamide-based latent curing agent |
| Product Form | White to off-white free-flowing crystalline powder |
| Appearance | Crystalline solid, non-hygroscopic |
| Primary Applications | Epoxy resin systems for composites, laminates, and structural adhesives |
| Key Features | Latency, thermal activation, low volatility, high Tg capability |
| Benefits | Extended shelf life, processing flexibility, consistent cure performance |
| Recommended Storage | Below 25 °C in sealed containers, protected from moisture |
| Cure Onset Temperature | Approx. 120 °C (as measured by DSC) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
