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Latent at room temperature, enabling extended pot life and improved processing window for epoxy formulations.
Activates rapidly at elevated temperatures (typically >120 °C), delivering efficient and consistent cure kinetics.
Halogen-free formulation, supporting compliance with environmental and regulatory requirements for electronics and aerospace.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Delivers high glass transition temperature (Tg) and robust thermal-mechanical performance in cured systems.
Encapsulants and underfills for semiconductor packaging and microelectronics.
Structural adhesives for aerospace composite bonding and metal-to-composite joining.
Prepregs and infusion resins for high-performance wind turbine blades and automotive composites.
Electrical insulation materials requiring low ionic contamination and high dielectric strength.
High-reliability potting compounds for power electronics and LED modules.
| Chemical Type | Dicyandiamide-based latent accelerator system |
| Product Form | Free-flowing white to off-white crystalline powder |
| Appearance | Crystalline solid, free of visible impurities |
| Primary Applications | Epoxy encapsulation, structural adhesives, prepregs, electrical insulation |
| Key Features | Room-temperature latency, thermally activated cure, halogen-free |
| Storage Stability | Stable ≥12 months at 25 °C in sealed container |
| Recommended Cure Schedule | 150 °C for 60–90 minutes (varies by resin system) |
| Handling Precautions | Use in well-ventilated area; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
