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Latent reactivity enables extended pot life and ambient storage stability prior to thermal activation.
High-temperature curing profile (typically activated above 120 °C) ensures precise process control and low exotherm during handling.
Delivers excellent mechanical properties, including high glass transition temperature (Tg) and dimensional stability in cured epoxy systems.
Low volatility and minimal odor support safer industrial handling and compliance with occupational health guidelines.
Compatible with standard diglycidyl ether of bisphenol-A (DGEBA) and multifunctional epoxy resins.
Aerospace composite tooling and mandrels requiring high-temperature performance and low residual stress.
Electrical encapsulation and insulating components for power electronics and transformers.
High-performance adhesives for structural bonding in automotive and rail transportation.
Precision casting resins used in investment molding and prototyping applications.
Prepregs and filament-wound composites where controlled cure kinetics and shelf-life are critical.
| Chemical Type | Dicyandiamide-based latent accelerator system |
| Product Form | Free-flowing white crystalline powder |
| Appearance | White to off-white granular solid |
| Primary Applications | Epoxy resin curing agent for high-performance thermosets |
| Key Features | Latent, thermally activated, low dust generation |
| Benefits | Extended shelf life (>12 months at 25 °C), consistent cure response, low moisture sensitivity |
| Recommended Storage | Sealed container, dry conditions, below 30 °C |
| Handling Precautions | Use in well-ventilated areas; avoid inhalation of dust and skin contact |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
