English
Español
tiếng việt
русский
Low-viscosity liquid formulation enabling easy handling and homogeneous mixing with epoxy resins.
Modified aromatic amine chemistry delivering enhanced thermal stability and reduced exotherm versus standard DDM-type hardeners.
Improved compatibility with bisphenol-A and bisphenol-F epoxy systems without phase separation.
Reduced volatility and lower skin sensitization potential compared to conventional aromatic amines.
Enables room-temperature cure with good through-cure performance and post-cure flexibility.
Structural adhesives for aerospace and transportation bonding.
High-performance composite matrices in wind turbine blades and sporting goods.
Electrical encapsulation and potting compounds requiring low shrinkage and high dielectric strength.
Industrial flooring and protective coatings demanding chemical resistance and rapid return-to-service.
Repair mortars and grouts where controlled reactivity and extended working time are critical.
| Chemical Type | Modified aromatic amine |
| Product Form | Liquid |
| Appearance | Clear, pale yellow liquid |
| Primary Applications | Epoxy resin curing agent for structural composites, adhesives, and coatings |
| Key Features | Low viscosity, reduced toxicity profile, balanced reactivity |
| Benefits | Improved processability, enhanced thermal and mechanical performance, safer handling |
| Storage Stability | 12 months at 25°C in original sealed container |
| Reactivity Profile | Medium-reactive; suitable for RT cure with optional post-cure |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
