English
Español
tiếng việt
русский
Low-viscosity liquid formulation enabling excellent mixing and processing with standard epoxy resins.
Room-temperature curing capability with balanced pot life and rapid development of mechanical strength.
Superior adhesion to metals, composites, and cured polymer substrates without surface priming.
Enhanced chemical resistance, particularly to alkalis, solvents, and mild acids after full cure.
Low odor and low volatility, supporting safer handling in ventilated industrial environments.
Structural adhesives for automotive assembly and lightweight component bonding.
Electrical encapsulation and potting compounds for power electronics and control modules.
High-performance coatings for industrial flooring and corrosion-resistant tank linings.
Composite matrix systems in wind turbine blade manufacturing and aerospace tooling.
Repair mortars and grouts for concrete infrastructure rehabilitation.
| Chemical Type | Modified aliphatic amine |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, free from sediment or haze |
| Density (25°C) | 0.92–0.94 g/cm³ |
| Viscosity (25°C) | 180–220 mPa·s |
| Amine Value | 360–390 mg KOH/g |
| Reactivity Profile | Medium-reactive; gel time ~45–60 min at 25°C with DGEBA resin (100 phr) |
| Storage Stability | 12 months unopened at 5–25°C in original sealed container |
Q1: What type of epoxy systems is KINGMIDE-315 designed for?
A: KINGMIDE-315 is a latent, amine-based curing agent formulated primarily for use with solid or liquid bisphenol-A and bisphenol-F epoxy resins in thermosetting applications requiring controlled reactivity, extended pot life, and high thermal stability.
Q2: How does KINGMIDE-315 compare to conventional DICY or aromatic amine hardeners in terms of processing behavior?
A: Unlike highly reactive aromatic amines, KINGMIDE-315 offers improved latency at ambient temperatures—enabling longer shelf life of pre-mixed systems—while delivering faster and more consistent cure development under moderate heat activation (typically above 120 °C), without the handling hazards associated with DICY dust or volatile amines.
Q3: Is KINGMIDE-315 suitable for electrically insulating applications such as encapsulants or PCB laminates?
A: Yes—KINGMIDE-315 contributes to excellent dielectric strength, low ionic impurity content, and stable electrical properties after full cure, making it well-suited for high-reliability electrical insulation and electronic packaging formulations.
Q4: What are the recommended storage conditions to maintain product integrity?
A: Store in original sealed containers at temperatures between 5 °C and 30 °C, protected from moisture, direct sunlight, and strong oxidizing agents. Prolonged exposure to humidity or elevated temperatures may reduce latency performance over time.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
