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Low-viscosity polyamide curing agent enabling excellent flow and wetting of substrates.
Provides balanced pot life and rapid ambient-cure performance for efficient production cycles.
Delivers superior flexibility and impact resistance in cured epoxy systems.
Excellent adhesion to metals, concrete, and composite surfaces without primer.
Low amine blush tendency, supporting consistent surface quality in variable humidity conditions.
Industrial maintenance coatings for steel structures and offshore platforms.
High-performance flooring systems in pharmaceutical and food processing facilities.
Repair mortars and grouts for concrete infrastructure rehabilitation.
Adhesives and structural bonding compounds in transportation manufacturing.
Electrical encapsulation and potting compounds requiring thermal and mechanical resilience.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to brown viscous liquid |
| Primary Applications | Epoxy resin curing agent for coatings, adhesives, and composites |
| Key Features | Ambient-cure capability, low viscosity, low amine blush |
| Benefits | Improved productivity, enhanced substrate adhesion, reduced surface defects |
| Storage Stability | 12 months at 20–25°C in original sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
