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Low-viscosity liquid polyamide offering excellent compatibility with standard epoxy resins.
Enables room-temperature cure with good flexibility and impact resistance in final coatings.
Provides balanced pot life and gel time for reliable processing in industrial coating and adhesive applications.
Delivers superior adhesion to steel, aluminum, and concrete substrates.
Meets RoHS compliance requirements with no intentionally added heavy metals or restricted phthalates.
Industrial maintenance coatings for offshore and marine structures.
Epoxy-based floor coatings in warehouses, factories, and pharmaceutical cleanrooms.
Structural adhesives for metal-to-metal bonding in transportation equipment.
Repair mortars and grouts for civil engineering infrastructure projects.
Electrical encapsulation compounds requiring low exotherm and dimensional stability.
| Chemical Type | Polyamide adduct (modified aliphatic) |
| Product Form | Liquid |
| Appearance | Amber to light brown transparent liquid |
| Primary Applications | Epoxy resin curing agent for coatings, adhesives, and composites |
| Key Features | Room-temperature cure, flexible film formation, good chemical resistance |
| Benefits | Easy handling, low odor, extended working time at ambient conditions |
| Density (25°C) | Approx. 0.96–0.98 g/cm³ |
| Viscosity (25°C) | Approx. 300–600 mPa·s |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
